Description
RUT60R VER1.1 Advanced 2.5GbE Fanless Industrial Router Board
A high-performance fanless industrial motherboard featuring IntelĀ® Elkhart Lake J6412 processor, four IntelĀ® I225/I226 2.5GbE ports, 32GB DDR4 support, 5G M.2 expansion, and enterprise-grade networking capabilities for demanding edge computing and industrial IoT applications.
š Product Overview
The RUT60R VER1.1 represents the cutting edge of industrial computing platforms, combining the advanced IntelĀ® Elkhart Lake architecture with high-performance 2.5GbE networking. With its IntelĀ® Celeron J6412 quad-core processor, support for up to 32GB DDR4 memory, four IntelĀ® I225/I226 2.5GbE ports with BYPASS functionality, and comprehensive industrial I/O, this motherboard is engineered for the most demanding applications in industrial automation, edge computing, enterprise networking, telecommunications, and ruggedized embedded systems where maximum performance, reliability, and connectivity are essential.
š ļø Key Features
āAdvanced 2.5GbE Networking: Four IntelĀ® I225/I226 2.5GbE ports with dual BYPASS support for enterprise-level networking applications.
āModern IntelĀ® Elkhart Lake: IntelĀ® Celeron J6412 quad-core processor @ 2.0GHz with enhanced performance and efficiency.
āHigh-Capacity Memory: Supports up to 32GB DDR4 3200MHz memory for demanding applications.
ā5G & Wireless Connectivity: M.2 Key-B interface for 5G modules plus Mini-PCIe for Wi-Fi/4G connectivity.
āProfessional Console Interface: Dedicated Console port with optional dual RS485 and dual RS232 support for industrial communication.
āFanless Sealed Design: Passive cooling enables fully sealed enclosure construction for dust/water resistance in harsh environments.
āEnhanced Display Options: VGA header interface with optional HDMI support for flexible display configurations.
š§ Core System Specifications
CPU
IntelĀ® Celeron J6412 quad-core processor @ 2.0GHz
Compatible with IntelĀ® Elkhart Lake platform series
Compatible with IntelĀ® Elkhart Lake platform series
Memory (DDR4)
1 x SO-DIMM slot, supports 3200 MHz DDR4, maximum 32GB (Single Channel)
Storage
1 x mSATA 3.0 interface
1 x SATA 3.0 interface (supports 2.5″ HDD/SSD)
Note: The SATA interface and 2.5″ drive bay are mutually exclusive options
1 x SATA 3.0 interface (supports 2.5″ HDD/SSD)
Note: The SATA interface and 2.5″ drive bay are mutually exclusive options
Operating System
Windows 10, Linux
Graphics
Integrated IntelĀ® UHD Graphics (part of Elkhart Lake SoC)
Optional HDMI display output available
Optional HDMI display output available
š„ Display Interfaces
Display Outputs
1 x VGA header interface (onboard connector)
Optional: HDMI display output available
Provides flexibility for different display requirements
Optional: HDMI display output available
Provides flexibility for different display requirements
š Connectivity & I/O Ports
USB Ports
2 x USB 3.0 ports
3 x USB 2.0 ports (one dedicated for security dongle/encryption key)
3 x USB 2.0 ports (one dedicated for security dongle/encryption key)
Network
4 x IntelĀ® I225/I226 2.5GbE ports (RJ45, 10/100/1000/2500 Mbps)
Supports dual BYPASS functionality for high-availability enterprise networking
Combination of I225 and I226 controllers provides optimal performance and compatibility
Supports dual BYPASS functionality for high-availability enterprise networking
Combination of I225 and I226 controllers provides optimal performance and compatibility
Console & Serial Ports
1 x Console port (RJ45)
Optional: Support for 2 x RS485 and 2 x RS232 serial ports
Professional console interface for network equipment management and industrial communication
Optional: Support for 2 x RS485 and 2 x RS232 serial ports
Professional console interface for network equipment management and industrial communication
Wireless Expansion
1 x Mini-PCIe slot (supports Wi-Fi or 4G/LTE modules)
1 x M.2 Key-B slot (30Ć52mm) dedicated for 5G cellular modules
1 x M.2 Key-B slot (30Ć52mm) dedicated for 5G cellular modules
Fan Interface
1 x 4-pin CPU fan header (reserved)
Note: Primary cooling is passive/fanless; fan header for optional active cooling scenarios
Note: Primary cooling is passive/fanless; fan header for optional active cooling scenarios
GPIO
Supports 4-channel input & 4-channel output GPIO
Watchdog Timer
Hardware reset function (256 levels, 0~255 seconds)
ā” Power & Cooling Specifications
Input Voltage
DC 12V Ā±5%
Power Mode
Supports AT/ATX mode switching for flexible power management
Cooling System
Advanced fanless passive cooling design
Engineered for sealed enclosure construction providing dust-proof and moisture-resistant protection
Zero moving parts ensure maximum reliability, silent operation, and maintenance-free performance
Engineered for sealed enclosure construction providing dust-proof and moisture-resistant protection
Zero moving parts ensure maximum reliability, silent operation, and maintenance-free performance
Enclosure Compatibility
Specifically designed for integration into IP-rated sealed enclosures for protection against dust, moisture, and harsh industrial environments
š Environmental & Physical Specifications
Operating Temperature
-10Ā°C to +60Ā°C (Extended industrial temperature range for harsh environments)
Storage Temperature
-20Ā°C to +70Ā°C
Operating Humidity
5% to 95% RH (non-condensing)
Dimensions
170mm Ć 170mm (Standard Mini-ITX form factor)
ā ļø Important Notes
Memory Specifications: Supports DDR4 SO-DIMM memory modules (3200 MHz). Maximum supported capacity is 32GB. This represents a significant upgrade from previous generations, enabling more demanding applications. Ensure modules are compatible with IntelĀ® Elkhart Lake platform requirements.
2.5GbE Network Configuration: Features four IntelĀ® I225/I226 2.5GbE ports supporting both I225 and I226 controllers for optimal compatibility. For 2.5Gbps operation, use Cat5e or higher Ethernet cables. BYPASS functionality supports two port pairs for high-availability applications.
Power Supply Requirements: Use a stable, high-quality DC 12V Ā±5% power adapter with adequate current capacity. When utilizing all four 2.5GbE ports at full speed, 5G module, and maximum memory configuration, ensure the power supply can deliver sufficient current (typically 5-7A recommended for full load).
Thermal & Enclosure Design: The advanced fanless design enables IP-rated sealed enclosure construction. When designing enclosures for this higher-performance platform, ensure adequate thermal mass and heat dissipation considerations, especially when operating at 60Ā°C ambient temperature with full load.
Display Configuration: Standard configuration includes VGA header interface. Optional HDMI output is available – specify this requirement when ordering if needed. The VGA connection requires appropriate header-to-external connector cabling.
Console & Serial Port Options: Standard configuration includes one Console port (RJ45). Optional support for 2 x RS485 and 2 x RS232 serial ports is available for industrial communication applications. Specify these requirements when ordering.
Storage Configuration: The SATA 3.0 interface and 2.5″ drive bay are mutually exclusive options. The mSATA 3.0 interface provides additional high-speed storage. For maximum reliability in industrial applications, consider industrial-grade storage solutions rated for wide-temperature operation.
š Mechanical Dimensions
Unit: mm (Mini-ITX Standard – 170mm x 170mm)
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š¼ Product Images
RUT60R VER1.1 Side View Showing Advanced Heatsink
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